2025 Intern - Packaging Engineer
NXP Semiconductors
西青区, 天津市, 中国
Internship
Competitive
OfficeManager
Job Description
Job Description:
This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:
- New packaging technology development
- New package related process development
- Advanced material interface study
- Advanced IC package failure analysis
- Coordinate/lead development project independently
- Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)
Qualification:
- Pursuing in master degree
- Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
- At least CET-4 degree or equivalent English level and CET-6 is preferred.
- Intention and capability to work in a cross-functional/global team environment.
- Independent R&D capability.
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Job Details
- Job Type
- Internship
- Workplace Type
- Office
- Experience Level
- Manager
- Salary
- Competitive