<2026 Internship Program> Process Engineer Intern (Wire Bonding)
NXP Semiconductors
高雄市, Unknown, 臺灣
Internship
Competitive
OfficeManager
Job Description
- To work with operation/maintenance to ensure production smoothly.
- To assist action confirmations with system monitors.
- To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.
Job Qualification:
- Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
- Bachelor's or Master's student in Material/Science/Electronic Engineering or related
- Available to work at least 3 days/week.
- Good verbal and written English communication skills
- MS Office or Programming skill
- Self-motivated, results oriented, willing and eager to learn, proactive attitude
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Job Details
- Job Type
- Internship
- Workplace Type
- Office
- Experience Level
- Manager
- Salary
- Competitive