ENGINEER, APTD Bonding process

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Specific Responsibilities:

1. Drive HBM process development and yield improvement in WSS process.

2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development

4. Support project on-site execution and make decisions as technical consultant

5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues

6. Generate internal and external documentation for presentations and technical reports

Technology Development

1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.

2. Project engagement with cross-team interaction, providing expert contribution in materials characterization.

3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.

4. Provide recommendations for test structure and test vehicle design for material property evaluation.

5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.

Qualifications:

1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields

2. Must be at least 2 years experience in BONDING related works

3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:

a) Temporary bonding/debonding (TBDB)

b) Hybrid Bonding (Cu/dielectric)

c) Fusion Bonding / Direct wafer bonding

4. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding

5. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc

6. Innovative / integration mindset with independent thinking

7. Good team player with a high motivation

8. Fluent communication in both English and Chinese

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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