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Job Description:
As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10.
You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality.
Job Responsibility:
Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels
Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases
Design and execute bench DOE and probe engineering experiments to validate hypotheses and drive yield/quality improvement
Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality
Conduct circuit and layout tracing analysis to correlate electrical failure signatures to physical/process limitations
Support NPI qualification and HVM issue resolution, ensuring timely product release and manufacturing stability
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