IC Package Engineer (Starlink/Akoustis)

IC PACKAGE ENGINEER (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. The root of SpaceX’s success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game-changer and levels the playing field for those who were previously unconnected.

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. In this role, you’ll play a critical part in enabling high-reliability, high-performance electronics for cutting-edge applications. You will work cross-functionally with design, manufacturing, reliability, supply chain, and failure analysis teams to deliver optimized semiconductor packaging that meets stringent thermal, mechanical, and electrical requirements. The ideal candidate will bring hands-on experience in semiconductor packaging, materials science, and electronics manufacturing processes, with a passion for technical innovation and attention to detail.

RESPONSIBILITIES:

• Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
• Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
• Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
• Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
• Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
• Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
• Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
• Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
• Perform root cause analysis and rel="noopener noreferrer">here.  

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.