IC Packaging Engineer, Materials and Packaging Characterization

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention to detail and a passion for excellence to work towards extraordinary results? We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and help shape the next generation of category-defining Apple products.

Description

As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.

Responsibilities:

Package Characterization: Design and execute testing of IC packages under rigorous environmental and reliability stress conditions, including dynamic mechanical loading, thermal cycling, and moisture stressing.

Material Evaluation: Lead the characterization of advanced packaging materials (e.g., solders, polymers, dielectrics) and manage material characterization activities at external suppliers.

Methodology Development: Develop novel experimental methodologies, including designing custom fixtures, setting up specialized test equipment, and integrating advanced data acquisition systems.

Failure Analysis: Drive root-cause analysis and troubleshooting for complex packaging-related yield and reliability issues.

Preferred Qualifications

BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred

Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.

Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).

Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.

Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.

Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.

Minimum Qualifications

Minimum requirement of a bachelors degree

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $126,800 and $220,900, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.