Optical Test Engineer, Principal

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the companys COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The companys custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

We are seeking a world-class Senior Staff to Principal Optical Test Engineer to lead the development and execution of advanced test strategies for Co-Packaged Optics (CPO) solutions.

This senior role drives optical and electro-optical testing for next-generation high-bandwidth CPO modules and optical engines integrated with ASICs for AI, hyperscale data centers, and high-performance computing.

You will architect test methodologies, develop hardware/software platforms, and enable high-volume manufacturing while ensuring world-class performance, reliability, and yield. This is a high-impact technical leadership position at the forefront of silicon photonics and co-packaged optics innovation.

Key Responsibilities

• Lead the definition, development, and qualification of comprehensive test solutions for CPO optical engines, including wafer-level, die-level, package-level, and system-level testing.
• Design and implement optical test hardware and automation systems (e.g., active alignment, fiber array attachment, high-speed optical I/O characterization).
• Develop test programs and methodologies for key photonic parameters: insertion loss, eye diagrams, BER, PAM4 signaling, optical power, wavelength, thermal performance, and reliability stress testing.
• Collaborate closely with Silicon Photonics design, package engineering, product engineering, and manufacturing teams to optimize design-for-test (DFT) and manufacturability.
• Drive yield improvement, failure analysis, and root-cause investigations for complex electro-optical failures in CPO assemblies.
• Establish correlations between bench/lab validation, ATE production test, and system-level performance.
• Mentor junior engineers and provide technical direction on test architecture, equipment selection, and best practices for high-channel-count, high-speed optics.
• Support qualification, reliability testing (e.g., HTOL, temperature cycling), and customer audits for CPO products.
• Evaluate and integrate new test technologies, instrumentation, and automation frameworks to scale CPO production efficiently.
• Contribute to roadmaps for next-generation CPO test capabilities (e.g., higher data rates, multi-wavelength, advanced packaging).

Qualifications and Requirements

• Education: MS or PhD in Electrical Engineering, Optical Engineering, Physics, or a related field.
• Experience:
• 8+ years (Senior Staff) to 12+ years (Principal) of relevant experience in optical/photonic test engineering.
• Strong background in Co-Packaged Optics (CPO), silicon photonics, or high-speed optical transceivers (800G/1.6T+).
• Proven track record developing optical test solutions for wafer, package, or module-level testing in high-volume environments.
• Deep expertise in optical test instrumentation (e.g., optical spectrum analyzers, BER testers, oscilloscopes, tunable lasers, power meters, fiber alignment systems).
• Experience with automated test equipment (ATE), Python/LabVIEW/C# test development, and statistical process control (SPC).
• Knowledge of PAM4 signaling, signal integrity, mixed-signal testing, and reliability standards for data center optics.

Preferred Skills and Experience

• Hands-on experience with CPO-specific challenges: active alignment, thermal management, laser integration, fiber attach, and co-packaged ASIC testing.
• Familiarity with industry standards (e.g., IEEE 802.3, OIF, CMIS) and working with hyperscalers or module vendors.
• Experience in semiconductor foundry/OSAT ecosystems and transitioning from NPI to high-volume production.
• Track record of technical leadership, patents, or publications in photonics test.
• Strong problem-solving, communication, and cross-functional collaboration skills.

Salary range is $205,000 to $255,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.