Job Details:

Job Description:

The external Packaging and Assembly Engineering team (EPAE) plays a critical role in leveraging external assembly technologies to deliver leadership products. We are seeking a Thermal Engineer to perform Thermal analysis for advanced semiconductor packaging solutions, using a tool chain from layout extraction, thermal simulation by CFD solver, and thermal measurement validation. Packaging thermal design optimization as well as correlation of simulation with measurement results. This role will assess thermal performance through highly interacting with internal product design and pathfinding engineers on one end and assessing external suppliers on the other.

Job Description:

• Design and Develop Thermal Test Vehicle (TTV) from design concept, hardware implementation to experimental validation.

• Architect product design by providing thermal simulation and measurement validation.

• Scout technology roadmap to identify thermal innovations and contribute to product architect.

• Support thermal-mechanical simulation.

Key Responsibilities:

• Thermal Test Vehicle (TTV) Design and Development

• Architect and design thermal test vehicles to mimic realistic chip/package power distributions.

• Define heater layouts, and sensing strategies for correlation accuracy.

• Lead end-to-end execution: Concept to design to fabrication to validation.

• Model-to-Hardware Correlation

• Establish robust methodologies for correlating CFD/thermal simulations with experimental data.

• Perform sensitivity studies and calibration to minimize simulation vs measurement deviations.

• Compact / Reduced-Order Thermal Model Development

• Develop and deliver compact thermal models (CTMs) or reduced-order models (ROMs) for Package-and system level cases.

• Ensure models accurately represent dynamic and steady-state thermal behavior.

• Collaborate with internal business units to:

• Customize models for specific chip power use cases.

• Support integration into system simulation environments.

Qualifications:

• Bachelor/Master in Mechanical Engineering or similar degree with focus on packaging thermal and mechanical field.

• 5+ years' experience working in thermal field regarding packaging thermal simulation analysis and measurement characterization.

• Familiar with CFD (e.g. FloTherm, Icepak etc.) structural modelling, thermal analysis and measurement techniques.

• Experience with packaging thermal materials, such as integrated heat sink, thermal interface materials etc.

• Capability with thermal-mechanical simulation is a plus.

• Knowledge in advanced packaging 2.5D to 3D is a plus.

Technical Skills Details:

• Must-have: Deep expertise in Heat transfer fundamentals and Electronics cooling.

• Strong experience in: Thermal measurement techniques (thermocouples, IR, etc.), CFD tools (preferably Icepak, FloTHERM, etc.)

• Hands-on experience in: Power map emulation and heater design optimization, Model-to-hardware correlation workflows.

• Experience with: Reduced order modelling and Compact modelling techniques (e.g., RC networks, Foster models)

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location:

Taiwan, Hsinchu

Additional Locations:

Business group:

The Corporate Planning Group (CPG) is the strategic heartbeat of Intel, acting as catalyst for innovation and transformation, guiding the company towards achieving its vision and maintaining a competitive edge in the marketplace. CPG exists to build a comprehensive operating plan that leverages internal and external manufacturing for Intel's growth. We emphasize >

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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