PDE PIE (Package Integration Engineering) Senior Engineer/Engineer

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The PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups ( TPM/PMO-BU, TD, DESIGN, CEM, Site Engineering) , is responsible for the effective and efficient execution of new product transfer from NPN (new product notification) to high volume manufacturing. The success of this position will be assessed by the timely BU project timeline readiness for DC/ES/QS/Stick build, first time & on time package Qual release and the ability to ramp the product to minimum, predefined yield and quality targets from NPI-LVM and meeting 100% of handover criteria.

Key responsibilities and task:-

• To lead and manage the NPI activities as a Product Owner, working together with cross functional teams to accomplish organizational and business objectives by:
• Driving New Product Introduction process through NPI Phase Gate Review.
• Coordinating new product start-up and to achieve first pass qualification.
• Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team
• Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production;
• Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per PDT schedule.
• Regular monitoring the product yield trend; QDR and reliability to ensure that assembly operation is in control and initiate early attention if necessary;
• Owning the entire Product Life Cycle, from NPI to EOL.
• Understanding new product challenges and collaborate with Process / Equipment/Development owners to develop new technology capabilities ahead of market
• Acting as a point of contact to TPM on product related matters.

Requirements:

• Masters or Bachelor's degree in an Engineering (Mechanical, Material, Chemical).
• Min 8 years Experience in MNC semiconductor for mobile and automotive business.
• Must have strong packaging knowledge in backend engineering process or package development.
• Good technical knowledge in component test and/or module manufacturing process.
• Familiar with package structures (eg. BGA, PoP) and package reliability concepts.
• Excellent data analysis, statistical analysis, data interpretation skills. Proficient in JMP analysis is a must.
• Ability to make sound target="_blank">hrsupport_sg@micron.com

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