Principal Engineer, FE OCT CPEE ADT BOND
Micron Technology
Fab 10A, Singapore
Contract
Competitive
RemoteSenior
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).
You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.
Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)
Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
Drive process capability improvement (Cpk) and defect reduction
Lead yield enhancement initiatives by analyzing process, tool, and material interactions
Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques
Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions
Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)
Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements
Evaluate and introduce new materials/spares/parts for performance improvement
Support technology transfer and ramp-up across global sites
Align process baseline (POR) and ensure consistency through documentation and control plans
Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility
Diagnose and resolve manufacturing line issues impacting bonding yield and performance
Analyze process excursions and implement containment and recovery actions
Drive continuous improvement for cycle time, tool availability, and cost efficiency
Lead new process and baseline qualifications
Develop control plans, SPC strategies, and inline monitoring systems
Establish risk mitigation frameworks and ensure compliance with manufacturing standards
Partner with suppliers for technology development, process improvement, and cost optimization
Audit material and equipment suppliers to ensure quality and reliability targets are met
Collaborate with global teams and partners to drive alignment and execution
Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field
7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging
Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)
Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms
Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred
Proficiency in data analysis, SPC, and statistical modeling
Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)
Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment
Excellent communication and collaboration skills across global teams
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations,please contact hrsupport_sg@micron.com
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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