SMTS Diffusion & Thin Films
Micron Technology
Miaoli - Tongluo, Taiwan
Full-Time
Competitive
OfficeExecutive
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description Summary
The role requires a Member Technical Staff whohasbroad experience and innovative thinking. This person willleadthe improvement of Diffusion, Thin Film Deposition (PECVD/PVD), and Wet Etch processes in advanced DRAM technology nodes.
This role is critical to enablingmanufacturing requirementmemory products. It requires strong processintegrationexpertise, strategic vision, and leadership capabilities. You will drive innovation, lead technical initiatives, define technology roadmaps, and mentor engineering talent. The focus is on improving process capability and accelerating yieldramp.
Key Responsibilities
Coordinate all activities related to thecharacterization, andrefinement of Diffusion, PECVD/PVD thin film deposition, and Wet Etch processes for advanced DRAM applications.
Collaborate cross-functionally with Integration, Metrology, Equipment, and R&D teams to ensure process robustness and manufacturability.
Define and complete technical roadmaps aligned with DRAM scaling requirements and yield improvement targets.
Evaluate and implement advanced process technologies, including diffusion conditions optimization, novel thin film materials and deposition methods, and wet chemistry solutions.
Mentor and develop engineering talent, encouraging a culture of innovation and technical excellence.
Collaborate with equipment vendors and external partners to co-developmanufacturing requirementprocess solutions.
Drive root cause analysis (RCA) and continuous improvement initiatives for process-related challenges.
Present technical findings, progress, and recommendations to executive leadership and global teams.
Qualifications
Master’s or Ph.D.degreein Electrical Engineering, Materials Science, Chemical Engineering, Physics, ora relatedfield.
Minimum 10 years of hands-on experience in one or more of the following areas:
Proventrack recordof technical leadership in semiconductor process engineering.
Deep understanding of material properties, thin film growth mechanisms, interface control, and integration challenges.
Experience with leading equipment platforms (e.g., AMAT, TEL, Lam) and process characterization techniques.
Strong analytical, problem-solving, and communication skills.
Demonstrated ability to lead cross-functional teams and manage complex projects.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations,please contact at hrsupport_taiwan@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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