Technical Director, Advanced Packaging Integration

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

About the Role

We are seeking a highly skilled Advanced Packaging Technical Director to join the Disruptive Technology Pathfinding team within Applied Materials’ Advanced Packaging division. This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates. This role leads and/or develops and executes exceptionally complex technology and engineering development projects.

Key Responsibilities

• Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies

• Define, document, and implement end-to-end process flows for panel-level packaging technologies

• Lead material selection, characterization, and compatibility assessments for large form factor substrates

• Partner with customers to define and align process specifications and acceptance criteria

• Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers

• Contribute to Applied’s equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps

• Analyze process data to identify trends, drive optimization, and improve performance

• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability

• Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions

• Publish and present technical findings at leading industry conferences and in peer-reviewed journals

• Mentor and guide early-career engineers; provide technical direction and best practices

Requirements

• Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field

• In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows

• Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level

• Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs

• Proficiency in statistical data analysis (e.g. DoE, JMP)

• Knowledge of industry standards and best practices in semiconductor packaging

• Solid understanding of process characterization, metrology, materials & failure analysis

• Working knowledge of reliability requirements and qualification methodologies

• Proven capability to lead multi-functional teams to resolve complex technical problems

• Exceptional written and verbal communication skills

• Develop clear, compelling technical presentations and executive‑level slides to effectively convey complex concepts

• Drive structured technical discussions with customers and suppliers

• Articulate positions, influence decisions, and align technical direction

• Ability to produce high‑quality, technically rigorous written content such as reports, white papers, and publications

• Ability to work effectively across geographies and time zones

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 20% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.